As of April 30, 2026, TSM (Taiwan Semiconductor Manufacturing Co. Ltd. ADR) is in a parabolic state on the monthly chart, with a confidence level of 72%. Key support is at $330 and key resistance at $410. Monthly impulse continuation to new HH; last two candles show strong push back toward highs after a brief pullback; RSI stretched (~77).
Bullish continuation (likely wave-5 extension): price consolidates briefly then grinds higher; any dip holds above prior breakout area and EMA20 (~$265).
Parabolic mean-reversion / wave-4 style correction: rejection near highs leads to a deeper pullback toward the prior breakout and mid-MA cluster before trend resumes.
Monthly close above $400 with follow-through holding above $375
Monthly close below $330 (break of the most recent swing low support zone)
Buy-the-dip zones align with prior breakout/structure ($330–$360), then EMA20 area ($265–$300); heavy add only near EMA50 pink (~$192) if a larger wave-4 reset occurs.
Trim into strength while RSI is stretched and price is far above EMA50/100; higher bands reflect plausible Fibonacci extension regions after a wave-5 extension.
As of April 30, 2026, TSM (Taiwan Semiconductor Manufacturing Co. Ltd. ADR) is in a parabolic state on the monthly chart with 72% confidence. Monthly impulse continuation to new HH; last two candles show strong push back toward highs after a brief pullback; RSI stretched (~77).
On the monthly timeframe, TSM has key support at $330 and key resistance at $410. The most likely scenario (bullish) targets $410 and $450, with a revert level at $360.
TSM (Taiwan Semiconductor Manufacturing Co. Ltd. ADR) is currently classified as parabolic on the monthly chart, with 72% confidence. Confirmation requires: Monthly close above $400 with follow-through holding above $375 This would be invalidated by: Monthly close below $330 (break of the most recent swing low support zone)
The most likely scenario (bullish) targets $410 and $450, with a revert level at $360. The alternative scenario (bearish) targets $330 and $265.
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